Test, Assembly and Packaging of Photonic Devices

Photonics today is the driving technology for fields ranging from networking to chiplet packaging to sensor approaches like LIDAR and on to domains like quantum computing. To ensure error-free operation and economic manufacturability, the nanoscale-accurate optical alignment required in each photonic interconnection in each photonic device must be accomplished at scale with high yield, low losses, and speedy timeframes across the multiple channels of today’s array-based devices. Only PI can help to achieve this thanks to industrial-class technologies. PI’s Fast Multi-Channel Photonics Alignment (FMPA) systems like the F-712 and unique proprietary alignment algorithms, which are built into the controller, enable fast, parallel alignment of array components. Automated area scans allow fast and reliable mode selection and characterization, and intelligent parallel gradient search algorithm can optimally align and track all I/Os in array devices simultaneously. Thus, FMPA not only ensures lowest loss but also highest production throughput and best yield.