Test, Assembly and Packaging of Photonic Devices

Integrating photonic structures or elements such as waveguides, photodiodes, lasers, and multiplexers presents a variety of demanding challenges to test and assembly processes, starting at wafer level through to final packaging. The common theme: multiple channels, multiple elements, and multiple interacting inputs, as well as outputs, across multiple degrees of freedom, all requiring multiple alignment optimization. Traditionally, this is a time-consuming and expensive task. PI‘s Multi-Channel Photonics Alignment (FMPA) systems and unique proprietary alignment algorithms, which are built into the controller, automatically enable simultaneous alignment across channels, devices, and degrees of freedom, optimizing overall alignment in one quick step. Subsequently, compared to serial operation, reduction of 99 % in time and costs is possible.