Wafer Inspection & Metrology
Fast Scanning and Characterization at Wafer Level
Efficient wafer inspection and metrology are essential in semiconductor manufacturing to prevent yield loss. Achieving this requires precise wafer positioning, which enables fast and reliable analysis of defects and particles at every production stage.
PI’s cutting-edge piezo wafer positioning solution outperforms traditional electromagnetic systems with its innovative design, advanced control capabilities, and seamless connectivity. Featuring a dual-function piezo actuator, hybrid kinematics, and next-gen motion controller, the system delivers unmatched precision and reliability. The solution corrects wafer misalignment, maintains precise positioning, and eliminates heat generation by operating energy-free in a static state. Dynamic piezo adjustments ensure flatness and angular error compensation, guaranteeing consistent focus accuracy.
Z Axis - Dynamic Tracking
- Piezo motor technology
- Power off holding ability
- High resonant frequency enables highly dynamic tracking and correction mode for fine motion.
- Travel range: up to 4 mm coarse and 50 µm fine
- Move-and-settle time <10 ms (0.01 µm - 50 µm)
- Bidirectional repeatability: 10 nm (1 sigma)
- Position stability <5 nm
θZ Axis - High-Accuracy Motion
- Piezo motor technology
- High resonance frequency for highest stability
- Travel range: up to ±6 mrad for highest accuracy, can be extended to up to 360°
- Move-and-settle time <20 ms (0.1 µrad - 100 µrad)
- Bidirectional repeatability: 0.5 µrad (1 sigma)
- Position stability <0.05 µrad
System in Motion
